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Tuf 1621 Aoht K04s

TUF 1621 AOHT

  • Estimate pricingPrice on request
  • Mix ratio1:1 (Part A: Part B) by weight or volume
  • Outgassing standardNASA low outgassing (ASTM E-595)
  • Cure scheduleovernight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours
  • Serviceable temperature range-70°C to +200°C

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Supplier based in IndiaOn Global Trade Plaza since Oct 2026Similar products from other sellers

Products Description

PRODUCT HIGHLIGHTS Superior thermal conductivity Excellent toughness Convenient 1:1 mix ratio First-rate thermal conductivity Exceptional electrical insulation properties Capable of passing NASA low outgassing Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70°C to +200°C. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers exceptionally high lap shear strength (> 3,300 psi). TUF 1621 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers very good resistance to various chemicals, such as water, oils and fuels. Part A and Part B are off-white in color. TUF 1621 AOHT is widely used in electronic, optoelectronic, vacuum, aerospace and related industries. z

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Products Specification

  • Mix ratio1:1 (Part A: Part B) by weight or volume
  • Outgassing standardNASA low outgassing (ASTM E-595)
  • Cure scheduleovernight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours
  • Serviceable temperature range-70°C to +200°C
  • Lap shear strength> 3,300 psi

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Kohesi Bond

  • India India

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Business type - Contact Seller

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    TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. TUF 1621 AOHT is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70°C to +200°C. This adhesive fosters resistance to mechanical and thermal shocks. It offers high lap shear strength (> 3,300 psi). TUF 1621 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. Part A and Part B are off-white in color. TUF 1621 AOHT is widely used in electronic, optoelectronic, vacuum, aerospace and related industries.

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    The seller has not added a specification yet; ask for the data sheet or test certificate. Ask Kohesi Bond for a firm quote and delivery terms before you order.

    About Supplier

    Kohesi Bond is a B2B supplier based in India, listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Kohesi Bond for prices, specifications and documents for TUF 1621 AOHT.

    Supplier Details for TUF 1621 AOHT

    • Member since - Oct 2026
    • Business Type - Contact Seller
    • Deals in Product Type - Oat
    • Country - India

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