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PRODUCT HIGHLIGHTS Superior thermal conductivity Low coefficient of thermal expansion (CTE) Thixotropic Paste Superior dimensional stability Exceptional electrical insulation properties Capable of passing NASA low outgassing Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +200°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, KB 1631 HTC-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A and Part B have an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications. z
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KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +200°C. It is an adhesive that fosters physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. Part A and Part B have an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications.
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Kohesi Bond is a B2B supplier based in India, listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Kohesi Bond for prices, specifications and documents for KB 1631 HTC-1.
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Kohesi Bond, a B2B supplier from India, dispatches KB 1631 HTC-1 primarily through the port at India. Packaging types (e.g., bulk, custom, eco-friendly) and estimated pricing may vary based on order volume and destination. To get detailed logistics and pricing information, use Get a quote or Chat with supplier, or Sign Up for direct supplier interaction.