KB 1686 M

Estimate pricingPrice on request
Mix ratio1:1 by weight or volume
Volume resistivity5 - 10 ohm-cm
Serviceable temperature range-50°C to +120°C
ColorGray

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Supplier based in IndiaOn Global Trade Plaza since Oct 2026

Products Description

PRODUCT HIGHLIGHTS Easy mix ratio of 1:1 by weight or volume Outstanding dimensional stability Superior thermal conductivity High lap shear strength (> 2 100 psi) Nickel filled electrically conductive 100% solids system Kohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70Â°C - 90Â°C for 3 - 5 hours. KB 1686 M offers a volume resistivity of 5 - 10 ohm-cm. It is ideal for use in static dissipation and EMI/RFI shielding applications. It offers an extensive serviceable temperature range of -50Â°C to +120Â°C. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 - 1.4 W/m/K), it also offers astounding chemical resistance to various cleaning agents, oils and water. Part A and Part B are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (CTE). Owing to its versatile performance, KB 1686 M is widely used in electronics, aerospace, electrical, semiconductor, microwave and many OEM applications. TYPICAL APPLICATIONS : Bonding, Sealing, Coating z

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Agriculture

Products Specification

Mix ratio1:1 by weight or volume
Volume resistivity5 - 10 ohm-cm
Serviceable temperature range-50°C to +120°C
ColorGray
ConsistencyThixotropic paste like
Coefficient of thermal expansionVery low

Supplier information

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Kohesi Bond

India

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KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. It offers a volume resistivity of 5 - 10 ohm-cm and is ideal for use in static dissipation and EMI/RFI shielding applications. It offers an extensive serviceable temperature range of -50°C to +120°C. Part A and Part B are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (CTE).

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About Supplier

Kohesi Bond is a B2B supplier based in India, listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Kohesi Bond for prices, specifications and documents for KB 1686 M.

Supplier Details for KB 1686 M

Member since - Oct 2026
Business Type - Contact Seller
Deals in Product Type - Agriculture
Country - India

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