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KB 1631 AOLV-1

Estimate pricingPrice on request
Mix ratio1:1 by weight or volume
Open timelong
Exothermlow
Flow propertiesgood when mixed

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Supplier based in IndiaOn Global Trade Plaza since Oct 2026

Products Description

PRODUCT HIGHLIGHTS Superior thermal conductivity Low coefficient of thermal expansion (CTE) Excellent flow properties Superior dimensional stability Exceptional electrical insulation properties Easy mix ratio of 1:1 by weight or volume Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70Â°C - 90Â°C for 3 - 5 hours. KB 1631 AOLV-1 offers an extensive serviceable temperature range of -50Â°C to +120Â°C. Also, it is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 AOLV-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1631AOLV-1 also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has an off-white color. Owing to its remarkable performance and ease of use KB 1631 AOLV-1 is widely used in electronics, optoelectronic, major OEM and similar applications. z

Product Categories

Agriculture

Products Specification

Mix ratio1:1 by weight or volume
Open timelong
Exothermlow
Flow propertiesgood when mixed
Cure scheduleovernight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours
Serviceable temperature range-50°C to +120°C
Coefficient of thermal expansion (CTE)low

Supplier information

Basic member

Kohesi Bond

India

Business type - Contact Seller

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KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1631 AOLV-1 offers an extensive serviceable temperature range of -50°C to +120°C. Also, it is an adhesive that fosters physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 AOLV-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. Part A has a gray color and Part B has an off-white color. Owing to its remarkable performance and ease of use KB 1631 AOLV-1 is widely used in electronics, optoelectronic, major OEM and similar applications.

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About Supplier

Kohesi Bond is a B2B supplier based in India, listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Kohesi Bond for prices, specifications and documents for KB 1631 AOLV-1.

Supplier Details for KB 1631 AOLV-1

Member since - Oct 2026
Business Type - Contact Seller
Deals in Product Type - Agriculture
Country - India

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