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Pcb Prototype Assembly 23xk

Pcb Prototype Assembly

  • Estimate pricingPrice on request
  • ProcessesChip-on-board (COB), Surface-mount technology (SMT), Ball-grid array (BGA), Through-hole
  • Minimum PCB Dimension50x40mm
  • Maximum PCB Dimension600x400mm
  • Maximum Component Height25mm

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Supplier based in ChinaOn Global Trade Plaza since Oct 2026Similar products from other sellers

Products Description

PCB Prototype assembly: Chip-on-board (COB) Surface-mount technology (SMT) Ball-grid array (BGA) Through-hole Advantages: One-stop service included PCB fabrication and PCBA. Components sourcing Cost-effective Min order 1 pcs Serviceï¼? PCB fabrication Components sourcing PCB Assembly Capabilityï¼? The Minimum PCB Dimension: 50x40mm The Maximum PCB Dimensionï¼?600x400mm The Maximum Component Height: 25mm The Maximum PCB Weight: 3KG The Minimum Components Size: 0201(0.5Ã?0.25mm),Flip-CHIP,QFP,BGA,POP The Maximum Components Size: 55mm The Minimum PCB Dimension: 50x40mm The Maximum PCB Dimension : 510x460mm The BGA/QFP pitch :0.3mm Testing: ICT, Burn-in, Function Test,Temperature Cycling The Lead time of PCB assembly: 7-10 WDS

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Products Specification

  • ProcessesChip-on-board (COB), Surface-mount technology (SMT), Ball-grid array (BGA), Through-hole
  • Minimum PCB Dimension50x40mm
  • Maximum PCB Dimension600x400mm
  • Maximum Component Height25mm
  • Maximum PCB Weight3KG
  • Minimum Component Size0201(0.5x0.25mm), Flip-CHIP, QFP, BGA, POP
  • Maximum Component Size55mm
  • BGA/QFP Pitch0.3mm
  • TestingICT, Burn-in, Function Test, Temperature Cycling
  • Lead Time7-10 WDS
  • Minimum Order1 pcs

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King Sun Pcb Technology Co., Ltd.

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    This PCB prototype assembly service covers chip-on-board, surface-mount technology, ball-grid array and through-hole processes. It provides a one-stop service including PCB fabrication, component sourcing and assembly with a minimum order of 1 piece. Capabilities match the main assembly service: PCB dimensions from 50x40 mm up to 600x400 mm, maximum component height of 25 mm, maximum board weight of 3 kg, component sizes down to 0201 (0.5x0.25 mm) including flip-chip, QFP, BGA and POP, maximum component size of 55 mm, BGA/QFP pitch of 0.3 mm, and testing via ICT, burn-in, function test and temperature cycling. Lead time is 7-10 WDS.

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    The seller has not added a specification yet; ask for the data sheet or test certificate. Ask King Sun Pcb Technology Co., Ltd. for a firm quote and delivery terms before you order.

    About Supplier

    King Sun Pcb Technology Co., Ltd. is a B2B supplier based in China, listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask King Sun Pcb Technology Co., Ltd. for prices, specifications and documents for Pcb Prototype Assembly.

    Supplier Details for Pcb Prototype Assembly

    • Member since - Oct 2026
    • Business Type - Contact Seller
    • Deals in Product Type - PCB
    • Country - China

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