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LAYER Double side FPCB + partial PSR + SUS + CBF Application CCM Thickness 0.3T L/S 60/60 DRILL/LAND 200/350 Copper plating Inner Hole Min. 18 Inspection spec Zero defect in SUS and appearance
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Jinsung Electronics Co., Ltd
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This camera module FPCB manufacturing specification covers a double-sided flexible circuit with partial solder resist, SUS stiffener and coverlay bonding film. The application is CCM (compact camera module). Board thickness is 0.3T with line/space of 60/60 µm. Drill-to-land ratio is 200/350 µm. Inner-hole copper plating is at least 18 µm. Inspection requires zero defects on the SUS stiffener and overall appearance.
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Jinsung Electronics Co., Ltd is a B2B supplier based in South Korea (Republic Of Korea), listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Jinsung Electronics Co., Ltd for prices, specifications and documents for Camera Module FPCB Manufacturing Spec Multy.
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