10 layer gold fingers PCB
- Estimate pricingPrice on request
- Layers10
- Base materialFR-4 TG180 (ITEQ)
- Board thickness1.6mm
- Final copper35um
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Products Description
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au: min. Gold fingers/Au:30u Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection.
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Products Specification
- Layers10
- Base materialFR-4 TG180 (ITEQ)
- Board thickness1.6mm
- Final copper35um
- Surface finishImmersion Gold/Au: min.
- Gold fingersAu: 30u
- Solder maskGreen
- ProfileRouting
- E-test100% Fixture
- Quality reportSolderability test, Final inspection and Microsection
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The 10-layer PCB is built on FR-4 TG180 (ITEQ) with a board thickness of 1.6 mm and 35 µm final copper. It features an immersion gold surface finish and 30 µm gold fingers. The solder mask is green, the profile is routed and each board receives 100 % fixture e-test. Quality reporting includes solderability test, final inspection and microsection.
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The seller has not added a specification yet; ask for the data sheet or test certificate. Ask Head Electronic Co., Ltd. for a firm quote and delivery terms before you order.
About Supplier
Head Electronic Co., Ltd. is a B2B supplier based in China, listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Head Electronic Co., Ltd. for prices, specifications and documents for 10 layer gold fingers PCB.
Supplier Details for 10 layer gold fingers PCB
- Member since - Oct 2026
- Business Type - Contact Seller
- Deals in Product Type - PCB
- Country - China
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Head Electronic Co., Ltd., a B2B supplier from China, dispatches 10 layer gold fingers PCB primarily through the port at China. Packaging types (e.g., bulk, custom, eco-friendly) and estimated pricing may vary based on order volume and destination. To get detailed logistics and pricing information, use Get a quote or Chat with supplier, or Sign Up for direct supplier interaction.
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