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LAYER - 6Layer (FLEXIBLE 2layer+RIGID 4layer) 6-2-6 Application Inspection equipment of Semiconductor Thickness - 0.5T Structure - 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH Machine Drill Min. 0.25mm Cu Plating VIA FILL + PTH BGA(LAND/PITCH) - 0.3mm / 0.4pitch PSR GREEN Surface treatment ENIG
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Jinsung Electronics Co., Ltd
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This HDI rigid-flexible manufacturing specification uses a 6-layer stack-up (2 flexible layers + 4 rigid layers) in a 6-2-6 configuration for semiconductor inspection equipment. Total thickness is stated as 0.5T with a 1-2LBVH, 2-3L BVH, 1-4 stack BVH, 4-6BVH, and 56BVH structure. Minimum mechanical drill is 0.25 mm with copper plating via fill plus PTH. BGA land/pitch is 0.3 mm / 0.4 pitch, PSR is green, and surface treatment is ENIG.
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Jinsung Electronics Co., Ltd is a B2B supplier based in South Korea (Republic Of Korea), listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Jinsung Electronics Co., Ltd for prices, specifications and documents for HDI Rigid Flexible Manufacturing Spec.
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