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PIXEL 8M 13M 16M 20M Flatness & Tilt Special :30 Thickness 0.25T ~ 0.45T Structure 2-3L DRILL, 1-2L, 3-4L BLIND VIA Machine Drill Min. 0.15mm Laser Drill BVH Min. 0.10mm Cu Plating 18[+-3] / PTH or Via Fill BGA PITCH 0.4mm Under LAYER Rigid Flexible 4LAYER [4-2-4] / [4-2-2] PSR BLACK , BLUE , GREEN Surface treatment ENEPIG Stiffner PI , SUS Other EMI Impedance 100
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Jinsung Electronics Co., Ltd
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This camera module rigid-flexible manufacturing specification supports pixel counts of 8M, 13M, 16M and 20M with a flatness and tilt special requirement of 30. Board thickness ranges from 0.25T to 0.45T. The structure uses 2-3 layer drilling with 1-2 layer and 3-4 layer blind vias. Mechanical drilling minimum is 0.15 mm and laser-drilled blind vias go down to 0.10 mm. Copper plating is 18 µm ±3 µm with PTH or via fill. BGA pitch is under 0.4 mm. The rigid-flexible stack-up is 4-layer in either 4-2-4 or 4-2-2 configurations. Solder resist colors available are black, blue and green. Surface finish is ENEPIG. Stiffener materials are PI and SUS. EMI shielding is included and controlled impedance is 100 Ω.
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Jinsung Electronics Co., Ltd is a B2B supplier based in South Korea (Republic Of Korea), listed on Global Trade Plaza since October 2026. Use Inquire now or Chat with supplier to ask Jinsung Electronics Co., Ltd for prices, specifications and documents for Camera Module Rigid Flexible Manufacturing Spec.
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