SMCY-3000 Rotary Die Board Laser Cutting Machine

Quick Details Application: Laser Cutting Condition: New Laser Type: CO2 Applicable Material: Plywood, Wood Cutting Thickness: 0-20mm Cutting Area: 2000-3000mm Cutting Speed: 0.3-0.5m/min CNC or Not: Yes Cooling Mode: Water Cooling Control Software: CNC Graphic Format Supported: DXF, PLT Place of Origin: Hubei, China (Mainland) Brand Name: SENMAO Model Number: SMCY-3000 Certification: Patent Technology After-sales Service Provided: Engineers available to service machinery overseas Name: Cylindrical Die Board Laser Cutting Machine Laser power: 150W*2 Customized: Per client`s demand color: silvery Packaging & Delivery Packaging Details: Wooden Case 3 packages No.1: GW: 1110kgs NW: 960kgs Meas: 3.67m X 1.14m X 2.10n No.2: GW: 980kgs NW: 850kgs Meas: 3.55m X 1.14m X 1.58m No.3: GW: 70kgs NW: 50kgs Meas: 0.68m X 0.57m X 0.89m Manufacture Cylindrical Die Board Laser Cutting Machine price Introduction 1. One of series of cylindrical die board cutting machine 2. Adopting technology patented of two laser heads die cutting up and down at the same time 3. Being the new generation of laser die cutting machine and unparalled in the die cutting field 4. Ball screw driving with CNC system and special designed software guarantee the high precision and stability 5. High efficient and energy 6. Very low power consumption with only compressed air used and easy maintenance 7. Smoke extraction system making the working condition free of smoke pollution 8. Equipped with laser chiller Specification Model SMCY-3000 Application Cylindrrical die board cutting Laser type CO2 Laser power 150W*2 Catalogue Laser equipment Driving system Servo motor Cutting diameter 180-540mm Cutting length 3000mm Cutting precision 0.05mm Cutting width 0.35-0.71mm Cutting speed 0.36-0.6m/min Total power 3kw Patented No. ZL200320115463.X Applicable materials Wood and plywood Feature 1.Patented 2.2 laser heads cutting up & down same time 3.Cylindrical board Advatage * To meet the requirements in knife molding, printing and packaging * lower risk and cost and fast return of investment * Possibility to achieve efficient laser die cutting process * High efficiency and energy * Easy to edit core technical operations with low maintenance cost * Easier laser processing of cylindrical die board * Resolving all problems of kerfs of board surface and bottom are not vertical & slitting width is inconsistent and oblique slit phenomenon save the production cost of cylindrical die boards * Production processing even don not need additional gas of waiting for the machine boot when turn it on