PCB

Characteristic Capability Production Capacity 800,000 sq.ft/Month Layer(mass production) 1 to 24 Layers Max Panel Size 450*660mm Base Copper Thickness 1/3 OZ --5 OZ Impedance Control +/-8% Board ThicknessImpedance Control Min:6mil(0.15mm) Max:280mil(7mm) Blind/Buried hole YES Drilling (Minimum size) Mechanical drilling 8mil(0.2mm) Laser drilling 4mil(0.1mm) Inner Etching Minimum line/Space(A/W) 2.5mil(0.0625mm) Line Width Tolerance +/-8% Board Thickness(min) 2.5mil(0.625mm) Plating Hole Minimum Hole Size 6mil (0.15mm) Aspect Ratio (max) 12:01 Position Accuracy +/-1.8mil(0.045mm) Microvia Minimum Hole Size 3mil(0.075mm) Aspect Ratio (max) 1:01 Outer Etching Minimum Width /Space 2.5mil(0.05mm) Line Width Tolerance +/-0.4mil(0.01mm) Solder Mask Bridge 3.0mil(0.075mm) Position Accuracy 1.5mil(0.0375mm) Selective Gold Plating Gold Thickness 100u ís (2.5um) Press Thickness Tolerance 8% Wrap/Twist 0.70% Inner Opening (min) (1) 4/L:5mil(0.125mm) (2) 6/L-8/L:6mil(0.15mm) (3) 8/L or above:8mil(0.2mm) Lead Time sample S/D L:3days;4-8L:5-15days mass productioníí S/D L:5days;4-8L:10-25days Base Material Special Technology Surface Finish CEM-1/CEM-3/FR-4 FR4(Halogen free) High-speed & high-frequency material High Tg/CTI material Al-base PTFE,Rogers,Getek,BT,Polyimide blind hole PCB buried resistor PCB laser-drill HDI PCB mix-material PCB Plating edge PCB buried via PCB impedance control PCB heavy Cu PCB (5oz) Counter-Sink PCB ; HASL &Lead Free HASL Chem. Ni/Au Chem. Tin Ni/Au plating Flash Gold Gold finger OSP &F2 Chem. Silver