Particle board/Chipboard

Action Tesa first time in country has introduced European Quality Particle/Chip boards which is being manufactured by DOME Technology. The German "ClassiForm� Chip Grading" system ensures precise grading of the wood chips in the Particle Board ensuring a balanced core-to-surface chip size gradation. This results in perfect homogeneity hence a balanced & strong panel with very good screw holding capacity. Drying system for wood chips has been imported from MEC USA to give even moisture distribution in board resulting in structure stability of product. Inhouse glue is being manufactured for all products to make sure that all product must have reliable and stable quality in every lot. Pre-lamination is the pressing of MF impregnated decorative or solid color paper with uniform density & porosity on a Particle Board surface under controlled temperature & pressure in a define pressing cycle. PRODUCT RANGE AND SPECIFICATION: Grade Type : Available in both Grade 2 (Interior Grade) & Grade 1 (Exterior Grade) We also produce in E0, E1 & E2 Grade. Thicknesses: 9mm, 11mm, 12mm, 17mm, 18mm & 25mm Panel Size: 9ft x 6ft (2745mm x 1830mm), 8ft x 6ft (2440mm x 1830mm) PRELAMINATED PARTICLE BOARD RANGE (INTERIOR GRADE) OSL, BSL, BSB & OSR Thickness : 9mm,11mm, 12mm, 17mm, 18mm & 25mm Panel Size : 2745mm (9ft) x 1830mm (6ft) & 2440mm (8ft) x 1830mm (6ft) PRELAMINATED MDF PRODUCT RANGE (EXTERIOR GRADE) OSL, BSL, BSB & OSR Thickness : 9mm,12mm, 18mm & 25mm Panel Size: 2745mm (9ft) x 1830mm (6ft) & 2440mm (8ft) x 1830mm (6ft)