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layer count:20L base material: FR-4 TG170 copper thickness: all layers 2OZ board thickness: 3.2mm±0.3mm min hole diameter: 0.50mm(19mil) min trace width: 0.20mm(8mil) min trace spacing: 0.20mm(8mil) suface finishing: ENIG test: flying probe panel dimension: 106.63mmX134.42 mm panel method: 6up, 2*3 blind:dr1-2,dr3-4, 2 step blind vias via diameter: 0.5mm(19mil) lead time:fastest 10wds,normal 15-20 wds
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Shenzhen Hemeixin Electronics Co., Ltd. lists 3.2mm, 20l Blind&Buried Vias Board on Global Trade Plaza from China. The listing was added in June 2025.
Brand: Global Trade Plaza. Ask Shenzhen Hemeixin Electronics Co., Ltd. for a firm quote and delivery terms before you order.
Shenzhen Hemeixin Electronics Co., Ltd. is a B2B supplier based in China, listed on Global Trade Plaza since June 2025. Use Inquire now or Chat with supplier to ask Shenzhen Hemeixin Electronics Co., Ltd. for prices, specifications and documents for 3.2mm, 20l Blind&Buried Vias Board.
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Placing an order for 3.2mm, 20l Blind&Buried Vias Board with Shenzhen Hemeixin Electronics Co., Ltd. is quick and straightforward on Global Trade Plaza, a leading B2B marketplace for global buyers and suppliers. You can:
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Shenzhen Hemeixin Electronics Co., Ltd., a B2B supplier from China, dispatches 3.2mm, 20l Blind&Buried Vias Board primarily through the port at China. Packaging types (e.g., bulk, custom, eco-friendly) and estimated pricing may vary based on order volume and destination. To get detailed logistics and pricing information, use Get a quote or Chat with supplier, or Sign Up for direct supplier interaction.