S Diamond Co.

S Diamond Co. is a supplier based in South Korea (Republic Of Korea) that lists precision grinding and dicing tools on Global Trade Plaza. The company offers a Dicing Blade designed to minimize silicon wafer damage and optimize productivity and wheel life. It also lists Sapphire (LED Material) grinding tools including cup wheels for standard surface processing, core drills, C-surface flattening cup wheels, cylinder grinder cup wheels, and back grinding wheels for wafer thinning. Additional listings include a Semiconductor grinding wheel with a silicon wafer damage relief design, damage area minimization considering surface roughness, and a guttering effect wheel design. The SI Wafer Dicing Saw Blade is produced in vitrified, metal, resin and blade types to cut silicon wafer, sapphire, alumina, LCD and electronic parts. The Sapphire Wafer Back Grinding Wheel features a grinder load reducing design, efficient heat radiation with a clockwise diagonal blade model, and a sapphire-wafer-friendly design with easy wheel life adjustment. Buyers can send an enquiry through Global Trade Plaza.